Utilization of an arsenic diffused emitter in the fabrication of

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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29576R, 29578, 148 15, 148186, 148189, 357 63, 357 88, 357 89, 357 90, H01L 21223, H01L 2120

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active

040494780

ABSTRACT:
A substantially square N-type impurity distribution profile in a silicon substrate produces much superior dc and ac characteristics in PN junction devices than can be expected from the usual phosphorus distribution profile. Such a square profile is obtained by diffusion of arsenic in the silicon substrate. The sharper impurity gradient allows a relatively low surface concentration to be used for the device. This lower surface concentration relieves precipitation and dislocation problems.

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Magdo et al., "Ultra High Speed Transistor" I.B.M. Tech. Discl. Bull., vol. 13, No. 6, Nov. 1970, pp. 1423-1424.

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