Using sputter coated glass to stabilize microstrip gas chambers

Electricity: electrical systems and devices – Discharging or preventing accumulation of electric charge – Specific conduction means or dissipator

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361212, H05F 302

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056754701

ABSTRACT:
By sputter coating a thin-layer of low-resistive, electronically-conductive glass on various substrates (including quartz and ceramics, thin-film Pestov glass), microstrip gas chambers (MSGC) of high gain stability, low leakage current, and a high rate capability can be fabricated. This design can make the choice of substrate less important, save the cost of ion-implantation, and use less glass material.

REFERENCES:
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