Using scatterometry to verify contact hole opening during...

Details Using scatterometry to verify contact hole opening during... Using scatterometry to verify contact hole opening during...

2007-06-26

2007-06-26

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S014000, C700S121000, C702S167000

Reexamination Certificate

active

11069458

ABSTRACT:
Systems and methods are described that facilitate verifying that bottom apertures in tapered vias are open and free of obstruction. Scatterometry can be employed to monitor tapered via formation during and/or after a dry etch process on a photoresist bilayer. Information regarding critical dimensions at the bottoms of tapered vias can be analyzed to assess whether bottom apertures exhibit a minimum acceptable diameter that is equal to or greater than a predetermined threshold tolerance. Via apertures with dimensions below the threshold tolerance and/or regions of a wafer evincing unacceptable frequent occurrences of faulty via apertures are considered occluded, or suspect, and a corrective re-etch can be performed thereon.

REFERENCES:
patent: 6373053 (2002-04-01), Choo et al.
patent: 6545753 (2003-04-01), Subramanian et al.
patent: 6581023 (2003-06-01), Kim
patent: 6643557 (2003-11-01), Miller et al.
patent: 6842661 (2005-01-01), Chong et al.
patent: 6934032 (2005-08-01), Subramanian et al.
patent: 6944578 (2005-09-01), Bowley et al.
patent: 6972201 (2005-12-01), Subramanian et al.
patent: 7052575 (2006-05-01), Rangarajan et al.
patent: 7052921 (2006-05-01), Plat et al.
patent: 7155301 (2006-12-01), Li et al.

Affiliated with

Also associated with

Rating

Using scatterometry to verify contact hole opening during... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Using scatterometry to verify contact hole opening during..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Using scatterometry to verify contact hole opening during... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3851251