Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2005-06-28
2005-06-28
Picard, Leo (Department: 2125)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C430S296000
Reexamination Certificate
active
06912438
ABSTRACT:
A system and methodology are disclosed for monitoring and controlling a semiconductor fabrication process. Measurements are taken in accordance with scatterometry based techniques of repeating in circuit structures that evolve on a wafer as the wafer undergoes the fabrication process. The measurements can be employed to generate feed forward and/or feedback control data that can utilized to selectively adjust one or more fabrication components and/or operating parameters associated therewith to adapt the fabrication process. Additionally, the measurements can be employed in determining whether to discard the wafer or portions thereof based on a cost benefit analysis, for example. Directly measuring in circuit structures mitigates sacrificing valuable chip real estate as test grating structures may not need to be formed within the wafer, and also facilitates control over the elements that actually affect resulting chip performance.
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International Search Report, PCT/US 03/32656, mailed May 19, 2004.
J.R. McNeil, “Scatterometry Applied to Microelectronics Processing—Part 1”, Solid State Technology, Mar. 1, 1993, pp 29-30 and 32, vol. 36, No. 3, Cowan Publishing Corporation, Washington, United States.
Choo Bryan K.
Rangarajan Bharath
Singh Bhanwar
Subramanian Ramkumar
Amin & Turocy LLP
Kasenge Charles
Picard Leo
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