Using scatterometry to obtain measurements of in circuit...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S296000

Reexamination Certificate

active

06912438

ABSTRACT:
A system and methodology are disclosed for monitoring and controlling a semiconductor fabrication process. Measurements are taken in accordance with scatterometry based techniques of repeating in circuit structures that evolve on a wafer as the wafer undergoes the fabrication process. The measurements can be employed to generate feed forward and/or feedback control data that can utilized to selectively adjust one or more fabrication components and/or operating parameters associated therewith to adapt the fabrication process. Additionally, the measurements can be employed in determining whether to discard the wafer or portions thereof based on a cost benefit analysis, for example. Directly measuring in circuit structures mitigates sacrificing valuable chip real estate as test grating structures may not need to be formed within the wafer, and also facilitates control over the elements that actually affect resulting chip performance.

REFERENCES:
patent: 6429930 (2002-08-01), Littau et al.
patent: 6455212 (2002-09-01), Honeycutt et al.
patent: 2002/0018217 (2002-02-01), Weber-Grabau et al.
patent: 2002/0158193 (2002-10-01), Sezginer et al.
patent: WO 01/97279 (2001-12-01), None
International Search Report, PCT/US 03/32656, mailed May 19, 2004.
J.R. McNeil, “Scatterometry Applied to Microelectronics Processing—Part 1”, Solid State Technology, Mar. 1, 1993, pp 29-30 and 32, vol. 36, No. 3, Cowan Publishing Corporation, Washington, United States.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Using scatterometry to obtain measurements of in circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Using scatterometry to obtain measurements of in circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Using scatterometry to obtain measurements of in circuit... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3463364

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.