Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-01-09
2007-01-09
Chen, Jack (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S007000, C438S065000, C438S116000
Reexamination Certificate
active
11065147
ABSTRACT:
A method of manufacturing a light emitting semiconductor package on a semiconductor wafer252which includes a plurality of light emitting devices254residing on or in a surface of the semiconductor wafer, the method comprising the steps of: forming at least one first hollow cap256, each first hollow cap256formed to provide: a central portion260and first perimeter walls extending from the perimeter edge of the central portion with the free edges of the first perimeter walls adapted to be bonded to the surface of the semiconductor wafer252to provide a first cavity; at least one region258of the central portion260which is substantially transparent or translucent to electromagnetic radiation; aligning the at least one first cap with a corresponding at least one light emitting device using a tool having the same coefficient of thermal expansion as the wafer; bonding the at least one first hollow cap256to the semiconductor wafer252, the central portion overlying at least one of the plurality of light emitting devices254; and, separating the semiconductor wafer252with bonded caps256into light emitting semiconductor packages250.
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Chen Jack
Silverbrook Research Pty Ltd
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