Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-09-12
2006-09-12
Nguyen, Vinh P. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S1540PB
Reexamination Certificate
active
07106079
ABSTRACT:
A system that improves communications between capacitively coupled integrated circuit chips. The system operates by situating an interposer over capacitive communication pads on a first integrated circuit chip, wherein the interposer is made up of material that is anisotropic with respect to transmitting capacitive signals. A second integrated circuit chip is situated so that communication pads on the second integrated circuit chip are aligned to capacitively couple signals between the integrated circuit chips through the interposer. The increased dielectric permittivity caused by the interposer can improve capacitive coupling between opposing communication pads on the integrated circuit chips. The interposer can also reduce cross talk between communication pads on the first integrated circuit chip and pads adjacent to the opposing communication pads on the second integrated circuit chip.
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Drost Robert J.
Ho Ronald
Proebsting Robert J.
Grundler Edward J.
Nguyen Vinh P.
Park Vaughan & Fleming LLP
SUN Microsystems Inc.
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