Semiconductor device manufacturing: process – Gettering of substrate – By vibrating or impacting
Reexamination Certificate
2006-12-26
2006-12-26
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Gettering of substrate
By vibrating or impacting
C438S514000, C438S530000, C438S675000
Reexamination Certificate
active
07153760
ABSTRACT:
Acoustic energy may be utilized to generate phonons for activating implanted species. As a result, greater activation may be achieved with lower thermal budgets. Higher temperatures utilized in conventional processes may result in damage to semiconductor wafers. In some embodiments, the acoustic energy may be coupled with rapid thermal annealing, laser annealing, or other annealing processes. The acoustic energy may be developed by vibrational sources, laser energy, or other sources.
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Brewster William M.
Intel Corporation
Trop Pruner & Hu P.C.
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