Using a thru-hole via to improve circuit density in a PCB

Details Using a thru-hole via to improve circuit density in a PCB Using a thru-hole via to improve circuit density in a PCB

2006-11-28

2008-11-25

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S262000, C361S778000

Reexamination Certificate

active

07456364

ABSTRACT:
A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one layer of the printed circuit board and a second portion formed on another layer of the printed circuit board. The printed circuit board also includes a thru-hole via that includes at least two electrically conductive portions electrically isolated from each other, such that each of the electrically conductive portions connects electrically to both the first and second portions of a corresponding one of the electrically conductive traces.

REFERENCES:
patent: 6388208 (2002-05-01), Kiani et al.
patent: 6555761 (2003-04-01), Amir
patent: 6747217 (2004-06-01), Jochym et al.
patent: 2005/0224912 (2005-10-01), Rogers et al.

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