Using a supporting structure to control collapse of a die...

Details Using a supporting structure to control collapse of a die... Using a supporting structure to control collapse of a die...

2005-02-01

2005-02-01

Lee, Hsien-Ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S736000, C257S737000, C257S738000, C438S612000, C438S613000, C438S614000

Reexamination Certificate

active

06849944

ABSTRACT:
In one embodiment, an integrated circuit package includes a die associated with an integrated circuit and a die pad. The die has a bottom surface, and the pad has a top surface opposite the bottom surface of the die. Two or more bump pad traces are each coupled to the top surface of the pad, and one or more other traces are each coupled to the top surface of the pad in a corresponding inter-bump pad region between adjacent bump pad traces. A number of solder bumps each couple the die to the pad at a corresponding bump pad trace to provide electrical connectivity between circuitry associated with the die and circuitry associated with the die pad. Each inter-bump pad region is free from any solder mask material deposited to control collapse of the die towards the pad during a reflow process for bonding the die to the pad using the bumps, a supporting structure that contacts the die during the reflow process having been used instead.

REFERENCES:
patent: 5291062 (1994-03-01), Higgins, III
patent: 5872400 (1999-02-01), Chapman et al.
patent: 5991156 (1999-11-01), Bond et al.
patent: 6184062 (2001-02-01), Brofman et al.
patent: 6350669 (2002-02-01), Pu et al.
patent: 6507121 (2003-01-01), Huang

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