Use or organic acids in low residue solder pastes

Details Use or organic acids in low residue solder pastes Use or organic acids in low residue solder pastes

1990-05-17

1991-11-12

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 24, 148 25, B23K 3534

Patent

active

050644815

ABSTRACT:
Fluxing compositions are described containing as fluxing agents compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. The compound cleans oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water or formic acid. Very little or no undesired residue remains. Such acid fluxing agents can be used mixed with typical solder formulations, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent.

REFERENCES:
patent: 4278479 (1981-07-01), Anderson
patent: 4428780 (1984-01-01), Shedroff
patent: 4708751 (1987-11-01), Froebel
patent: 4960236 (1990-10-01), Hedges et al.
patent: 4963401 (1990-10-01), Kaspaul

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