Use of thermally conductive vias to extract heat from...

Details Use of thermally conductive vias to extract heat from... Use of thermally conductive vias to extract heat from...

2007-10-23

2007-10-23

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C165S080200, C165S080300, C257S720000, C257S713000

Reexamination Certificate

active

10842731

ABSTRACT:
A cooling device for a microcircuit provides a direct path of thermal extraction from a high heat producing area to a cooler area. A thermal insulation layer is formed on a body having at least one component thereon that generates the high heat producing area. At least one via is formed through an entire thickness of the insulation layer and is in direct communication with the high heat producing area. Heat from the high heat producing area is channeled through each via to the cooler area, which may be ambient atmosphere or a good thermal conductor, such as a heat sink. A thermal conductive material may be deposited within the via and increase the rate of thermal extraction therethrough.

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