Use of radiation sensitive polymerizable oligomers to produce po

Details Use of radiation sensitive polymerizable oligomers to produce po Use of radiation sensitive polymerizable oligomers to produce po

1984-10-19

1986-02-04

Powell, William A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

29576W, 29580, 156643, 156648, 1566591, 156668, 156904, 215911, 357 49, 427 431, 430296, 522174, H01L 2100, H01L 2712, B44C 122, B32B 328

Patent

active

045686017

ABSTRACT:
The photosensitivity of a particular group of polymerizable oligomers permits radiation induced polymerization. This photosensitivity thus enables the polymerizable oligomers to be used as photoresists in general, and facilitates in situ cure when the oligomers are used to produce isolation films and trenches in semiconductor devices. The photosensitivity further enables use of a simplified planarization process when the polymerizable oligomers are used in the fabrication of semiconductor structures and integrated circuit components. Specifically, the polymerizable oligomers are comprised of poly N-substituted amic acids, the corresponding amic esters, the corresponding amic isoimides, the corresponding amic imids or mixtures thereof, wherein the end groups of the polymerizable oligomer are end capped with a vinyl or acetylinic end group.

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