Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-06-02
1999-05-18
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 8912, 156 8928, 361760, 361764, B32B31/26
Patent
active
059047917
ABSTRACT:
A method of adhering an electronic component to substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered followed by heating to convert the preceramic polymer into a ceramic. The method forms a strong bond which is not affected by the environment. The method is valuable for adhering integrated circuit chips to carriers or circuit boards.
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Bearinger Clayton R.
Camilletti Robert Charles
Chandra Grish
Gentle Theresa Eileen
Haluska Loren Andrew
Dow Corning Corporation
Mayes Curtis
Severance Sharon K.
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