Use of plasma activated NF.sub.3 to clean solder bumps on a devi

Details Use of plasma activated NF.sub.3 to clean solder bumps on a devi Use of plasma activated NF.sub.3 to clean solder bumps on a devi

1996-12-23

1998-07-07

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

156281, 427 96, 4271261, 427294, 427399, 427535, 427569, C23C 1402

Patent

active

057765510

ABSTRACT:
A method for cleaning solder bumps on a substrate that may be employed in a flip-chip design, for example, is described. The method of cleaning includes placing the substrate having the solder bumps into a plasma reactor, introducing a source gas including nitrogen trifluoride gas into the plasma reactor, striking a plasma from the source gas in the plasma reactor, and forming a fluoride compound on the surface of the solder bump.

REFERENCES:
patent: 4921157 (1990-05-01), Dishon et al.
patent: 5407121 (1995-04-01), Koopman et al.
patent: 5499754 (1996-03-01), Bobbio et al.

Affiliated with

Also associated with

Rating

Use of plasma activated NF.sub.3 to clean solder bumps on a devi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of plasma activated NF.sub.3 to clean solder bumps on a devi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of plasma activated NF.sub.3 to clean solder bumps on a devi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1203139