Use of photosensitive stratum to create through-hole connections

Details Use of photosensitive stratum to create through-hole connections Use of photosensitive stratum to create through-hole connections

1981-06-15

1982-11-23

Hess, Bruce H.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having aperture or cut

427 97, 428551, 428558, 428559, 428601, 428626, 428131, 428137, 428206, 428208, 428209, 428323, 428325, 428328, 428329, 428469, 428901, 428936, 430319, B32B 324

Patent

active

043605702

ABSTRACT:
Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image areas, (f) optionally hardening or curing the particulate areas and (g) providing an electrically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or conjoining the metallized or catalyzed areas.

REFERENCES:
patent: 4283243 (1981-08-01), Andreades et al.

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