Use of photosensitive stratum to create through-hole connections

Details Use of photosensitive stratum to create through-hole connections Use of photosensitive stratum to create through-hole connections

1980-03-20

1981-08-11

Hess, Bruce H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156253, 156279, 156280, 156285, 156344, 427 431, 427 97, 427294, 427304, 427306, 428137, 428901, 430291, 430292, 430319, B44C 0000

Patent

active

042832438

ABSTRACT:
Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image areas, (f) optionally hardening or curing the particulate areas and (g) providing an electrically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or conjoining the metallized or catalyzed areas.

REFERENCES:
patent: 2912747 (1959-11-01), Oshry et al.
patent: 2912748 (1959-11-01), Oshry et al.
patent: 3557446 (1971-01-01), Charschan
patent: 4054479 (1977-10-01), Peiffer
patent: 4054483 (1977-10-01), Peiffer
patent: 4127436 (1978-11-01), Friel
Romankin et al., "Plating Through-Holes", IBM Technical Disclosure Bulletin, vol. 9, No. 10, Mar. 1967.

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