Use of palladium as an adhesion layer and as an electrode in fer

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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361321, 365145, 257295, H01G 406, H01G 410, H01L 2702, G11C 1122

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active

051915103

ABSTRACT:
A ferroelectric capacitor for a ferroelectric memory device includes a substrate, a silicon dioxide layer, a palladium adhesion layer, a bottom electrode of platinum, a metal or an alloy, a ferroelectric material and a top electrode of platinum, a metal or an alloy.

REFERENCES:
patent: 3184660 (1965-05-01), Robinson
patent: 3569802 (1971-03-01), Brauer et al.
patent: 3579063 (1971-05-01), Wasa et al.
patent: 3819990 (1974-05-01), Hayashi et al.
patent: 4149301 (1979-04-01), Cook
patent: 4149302 (1979-04-01), Cook
patent: 4636908 (1987-01-01), Yoshihara et al.
patent: 4707897 (1987-11-01), Rohrer et al.
patent: 4809225 (1989-02-01), Dimmler et al.
patent: 4853893 (1989-08-01), Eaton, Jr. et al.
patent: 4873664 (1989-10-01), Eaton, Jr. et al.
patent: 4888733 (1989-12-01), Mobley
patent: 4893272 (1990-01-01), Eaton, Jr. et al.
patent: 4910708 (1990-03-01), Eaton, Jr. et al.
patent: 4914627 (1990-04-01), Eaton, Jr. et al.
patent: 4918654 (1990-04-01), Eaton, Jr. et al.
patent: 4982309 (1991-01-01), Shepherd
patent: 5003428 (1991-03-01), Shepherd
patent: 5005102 (1991-04-01), Larson
patent: 5024964 (1991-06-01), Rohrer et al.
patent: 5046043 (1991-09-01), Miller et al.
patent: 5122923 (1992-06-01), Matsubara et al.
S. F. Vogel and I. C. Barlow, Sputtered Platinum as Substrate for Ferroelectric Film Deposition, J. Vac. Sci. Technol., vol. 10, No. 5, Sep./Oct. 1973.
Patent Interference No. 100,842, Rohrer et al. v. Cook.
Chin-An Chang, Deposition of (100) Au, Ag, Pt, Pb, and Fe on (100) Si Using Differential Metal Seed Layers, J. Vac. Sci. Technol. A, vol. 9, No. 1, Jan./Feb. 1991.

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