Use of organopolysiloxane compositions which cure at ambient tem

Details Use of organopolysiloxane compositions which cure at ambient tem Use of organopolysiloxane compositions which cure at ambient tem

1975-05-05

1976-06-22

Weiffenbach, Cameron K.

Coating processes

Electrical product produced

Metallic compound coating

427387, B05D 512

Patent

active

039652807

ABSTRACT:
Electrical and electronic devices are coated with an organopolysiloxane composition which consists essentially of a mixture of the following ingredients by weight:
I 100 parts of a .alpha.,.omega.-dihydroxydiorganopolysiloxane polymer, of viscosity at least about 600 cPo at 25.degree.C,
ii 1 to 15 parts of an organosilicon compound which is either
A a monomer of the formula (A): R.sub.x Si[(OCH.sub.2 CH.sub.2).sub.a OR'].sub.4.sub.-x', or
B a polymer resulting from the partial hydrolysis of at least one monomer of formula Si(OR').sub.4 ;
iii 0.2 to 6 parts of an organic derivative of titanium, which is either:
A a monomer of the formula (B): Ti[OCH.sub.2 CH.sub.2).sub.b OR"].sub.4',
b a polymer resulting from the partial hydrolysis of at least one monomer of the formula Ti(OR").sub.4 ;
c a titanium chelate of the formula (C): ##EQU1## OR D A TITANIUM CHELATE OF THE FORMULA (D): ##EQU2## iv 0 to 100 parts of an optionally organosilicontreated inorganic filler; V 0 TO 100 PARTS OF PLASTICISER AND/OR ORGANOSILICON STABILISER; AND
Vi 0.5 to 8 parts of an organosilicon resin consisting of units of the formulae R"'(CH.sub.3).sub.2 SiO.sub.0.5 and SiO.sub.2. The coating is then cured on the device. Neither the composition nor the elastomers obtained therefrom on curing corrode copper or other metals.

REFERENCES:
patent: 3796686 (1974-03-01), Golitz et al.
patent: 3849187 (1974-11-01), Fetscher et al.

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