Use of microencapsulated glue in the manufacture of envelopes

Stock material or miscellaneous articles – Composite – Of bituminous or tarry residue

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

93 62, 93 74, 428307, B31B 1960

Patent

active

041343220

ABSTRACT:
Envelopes having moistenable gum on the seal flap and back gum adhering the sides and bottom are manufactured by a process comprising applying a back gum to either the bottom flap or the side flaps in the form of microcapsules. When the bottom and side flaps are folded and pressure is applied, the microcapsules rupture causing the back gum to adhere the bottom and side flaps. Gum in the form of microcapsules can also be applied to the seal flap allowing the end user to seal without moisture.

REFERENCES:
patent: 2420963 (1947-05-01), Malo
patent: 2986477 (1961-05-01), Elchel
patent: 4055111 (1977-10-01), Howatt

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Use of microencapsulated glue in the manufacture of envelopes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of microencapsulated glue in the manufacture of envelopes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of microencapsulated glue in the manufacture of envelopes will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-646997

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.