Use of immersion tin and tin alloys as a bonding medium for mult

Details Use of immersion tin and tin alloys as a bonding medium for mult Use of immersion tin and tin alloys as a bonding medium for mult

1987-10-21

1989-11-21

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4274431, 4274301, 106 122, 156280, B05D 512

Patent

active

048822027

ABSTRACT:
A novel immersion tin composition is disclosed containing both thiourea compounds and urea compounds. A method for improving the adhesion of printed circuit boards to one another in a multilayer board and for minimizing or eliminating smear in a multilayer board is also disclosed comprising coating the metal layers of the individual circuit boards with an immersion tin coating prior to laminating them to form a multilayer board.

REFERENCES:
patent: 3536546 (1970-10-01), Nielsen et al.
patent: 3689292 (1972-09-01), Preston
patent: 4027055 (1977-05-01), Schneble
patent: 4061588 (1977-12-01), Gulla
patent: 4151311 (1979-04-01), Feldstein
patent: 4194913 (1980-03-01), Davis
patent: 4309454 (1982-01-01), Feldstein
patent: 4511403 (1985-04-01), Orio
patent: 4550037 (1985-10-01), Kinkelaar
patent: 4657632 (1987-04-01), Holtzman
A. F. Schmeckenbecher, "Electroless Nickel-Tin Process", IBM Technical Disclosure Bulletin, Vol. 19, No. 3, Aug., 1976, p. 928.

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