Use of immersion tin and tin alloys as a bonding medium for mult

Details Use of immersion tin and tin alloys as a bonding medium for mult Use of immersion tin and tin alloys as a bonding medium for mult

1985-08-29

1987-12-29

Wax, Robert

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 125, 106 126, 106 127, 106 129, C23C 1846

Patent

active

047158948

ABSTRACT:
A novel immersion tin composition is disclosed containing both thiourea compounds and urea compounds. A method for improving the adhesion of printed circuit boards to one another in a multilayer board and for minimizing or eliminating smear in a multilayer board is also disclosed comprising coating the metal layers of the individual circuit boards with an immersion tin coating prior to laminating them to form a multilayer board.

REFERENCES:
patent: 2282511 (1942-05-01), Bradley
patent: 3303029 (1967-02-01), Shipley
patent: 3741905 (1973-06-01), Saubestre et al.
patent: 3875029 (1975-04-01), Rosenberg et al.
patent: 4084022 (1978-04-01), Tratz et al.
patent: 4316322 (1982-02-01), Tranberg et al.
Communication from European Pat. Office EP No. 86306655.1 including European Search Report (and "annex" thereto).
Derwent Publication, Acc. No. 80-67141c/38, Russian Pat. No. 712-455, Jan. 30, 1980.

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