Use of immersion tin and alloys as a bonding medium for multilay

Details Use of immersion tin and alloys as a bonding medium for multilay Use of immersion tin and alloys as a bonding medium for multilay

1986-10-29

1989-03-28

Barr, Josephine

Compositions: coating or plastic

Coating or plastic compositions

Pore forming

106 125, 106 126, 106 127, 106 129, C23C 1846

Patent

active

048160709

ABSTRACT:
A novel immersion tin composition is disclosed containing both thiourea compounds and urea compounds. A method for improving the adhesion of printed circuit boards to one another in a multilayer board and for minimizing or eliminating smear in a multilayer board is also disclosed comprising coating the metal layers of the individual circuit boards with an immersion tin coating prior to laminating them to form a multilayer board. The immersion tin composition may also be prepared from a two component system which eliminates or substantially retards the formation of H.sub.2 S in the presence of sulfur containing components.

REFERENCES:
patent: 3303029 (1967-02-01), Shipley
patent: 3741905 (1973-06-01), Saubestre et al.
patent: 3875029 (1975-04-01), Rosenberg et al.
patent: 4084022 (1978-04-01), Tratz et al.
patent: 4316322 (1982-02-01), Tranberg et al.
Dewent Publication, Acc. No. 80-67141c/38 Russian Pat No. 712-455, 1-30-80.

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