Use of hydrogen implantation to improve material properties...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S194000, C257S616000, C257SE29246, C257SE33009

Reexamination Certificate

active

10982411

ABSTRACT:
A method of forming a relaxed SiGe-on-insulator substrate having enhanced relaxation, significantly lower defect density and improved surface quality is provided. The method includes forming a SiGe alloy layer on a surface of a first single crystal Si layer. The first single crystal Si layer has an interface with an underlying barrier layer that is resistant to Ge diffusion. Next, ions that are capable of forming defects that allow mechanical decoupling at or near said interface are implanted into the structure and thereafter the structure including the implanted ions is subjected to a heating step which permits interdiffusion of Ge throughout the first single crystal Si layer and the SiGe layer to form a substantially relaxed, single crystal and homogeneous SiGe layer atop the barrier layer. SiGe-on-insulator substrates having the improved properties as well as heterostructures containing the same are also provided.

REFERENCES:
patent: 6090689 (2000-07-01), Sadana et al.
patent: 6524935 (2003-02-01), Canaperi et al.
patent: 6555839 (2003-04-01), Fitzgerald
patent: 6573126 (2003-06-01), Cheng et al.
patent: 6583015 (2003-06-01), Fitzgerald et al.
patent: 6593191 (2003-07-01), Fitzgerald
patent: 6593641 (2003-07-01), Fitzergald
patent: 6607948 (2003-08-01), Sugiyama et al.
patent: 6649480 (2003-11-01), Fitzgerald et al.
patent: 6689211 (2004-02-01), Wu et al.
patent: 6690043 (2004-02-01), Usuda et al.
patent: 6703144 (2004-03-01), Fitzgerald
patent: 6713326 (2004-03-01), Cheng et al.
patent: 6724008 (2004-04-01), Fitzgerald
patent: 6730551 (2004-05-01), Lee et al.
patent: 6830976 (2004-12-01), Fitzgerald
patent: 6940089 (2005-09-01), Cheng et al.
patent: 6969875 (2005-11-01), Fitzgerald
patent: 2001/0042503 (2001-11-01), Lo et al.
patent: 2002/0104993 (2002-08-01), Fitzgerald et al.
patent: 2002/0168864 (2002-11-01), Cheng et al.
patent: 2003/0199153 (2003-10-01), Kovacic et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Use of hydrogen implantation to improve material properties... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of hydrogen implantation to improve material properties..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of hydrogen implantation to improve material properties... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3885088

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.