Use of hydrofluoric acid for effective pad conditioning

Details Use of hydrofluoric acid for effective pad conditioning Use of hydrofluoric acid for effective pad conditioning

1997-08-27

1999-06-22

Scherbel, David A.

Abrading

Abrading process

With tool treating or forming

451443, 451444, B24B 100

Patent

active

059137150

ABSTRACT:
A process of conditioning a polishing pad used in chemical mechanical polishing of an integrated circuit and having a glazed layer is described. The process includes introducing a conditioning reagent including at least one of hydrofluoric acid, buffered oxide etch composition and potassium hydroxide on the polishing pad to dissolve at least a portion of the glazed layer; and abrading the glazed layer and disloding at least some particles from the glazed layer.

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