Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1998-01-28
2000-05-16
Gulakowski, Randy
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
510175, C03C 2300, C23G 100
Patent
active
060632054
ABSTRACT:
A method for post lapping cleaning of silicon wafers wherein the lapped wafer surfaces are cleaned and passivated by being treated with an aqueous hydrogen peroxide solution of about 0.5 to 2% by weight of hydrogen peroxide and then dried.
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Cooper Steven P.
Sato Michito
Gulakowski Randy
Wilkins Yolanda E.
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