Cutting – Processes
Patent
1997-09-16
1998-06-30
Rachuba, Maurina T.
Cutting
Processes
83684, 83690, 83948, B26D 100
Patent
active
057717648
ABSTRACT:
A method of cutting, slicing or perforating photographic imaging elements using certain cutting tools is disclosed. The cutting tool material includes zirconia and yttria at a molar ratio of yttria to zirconia from about 0.5:99.5 to about 5:95. The cutting tool is essentially a tetragonal crystal phase grain for the interior in a surface of cubic crystal phase grain or monoclinic crystal phase grain. This provides a hard, tough outer surface with a tough core. The cutting tool material can also be a composite of zirconia-alumina with or without surface modification.
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Chatterjee Dilip K.
Eichorst Dennis J.
Ghosh Syamal K.
Eastman Kodak Company
Rachuba Maurina T.
Rosenstein Arthur H.
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