Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1997-08-26
2000-05-30
Talbot, Brian K.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427307, 216692, 216693, 438692, 438959, B05D 512, H01L 21461
Patent
active
060688793
ABSTRACT:
A process of inhibiting a corrosion of metal plugs formed in integrated circuits is described. The corrosion inhibiting process includes providing a partially fabricated integrated circuit surface including the metal plugs on a polishing pad to carry out chemical-mechanical polishing, introducing slurry including a corrosion inhibiting compound on the polishing pad in sufficient concentration to inhibit corrosion of the metal plugs of the partially fabricated integrated circuit surface, and polishing the partially fabricated integrated circuit surface.
REFERENCES:
patent: 3816185 (1974-06-01), Toledo et al.
patent: 3868217 (1975-02-01), Hollingshad
patent: 4343660 (1982-08-01), Martin
patent: 4497713 (1985-02-01), Geiger
patent: 4649025 (1987-03-01), Hwa et al.
patent: 4663053 (1987-05-01), Geiger
patent: 5017029 (1991-05-01), Andou et al.
patent: 5533635 (1996-07-01), Man
patent: 5607718 (1997-03-01), Sasaki et al.
patent: 5637185 (1997-06-01), Murarka et al.
patent: 5664989 (1997-09-01), Nakata et al.
patent: 5735963 (1998-04-01), Obeng
LSI Logic Corporation
Talbot Brian K.
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