Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Patent
1998-02-12
2000-09-12
Utech, Benjamin L.
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
216 2, 252 791, H01L 2100, H01L 21306
Patent
active
061177954
ABSTRACT:
A corrosion inhibiting cleaning process for removing etch-residue from an integrated circuit substrate is described. The corrosion inhibiting cleaning process includes: (1) obtaining an integrated circuit substrate that has undergone etching; and (2) cleaning the integrated circuit substrate using a post-etch cleaning solution including a corrosion inhibiting agent in a sufficient concentration to effectively inhibit corrosion of the integrated circuit substrate.
REFERENCES:
patent: 3816185 (1974-06-01), Toledo et al.
patent: 3868217 (1975-02-01), Hollingshad
patent: 4343660 (1982-08-01), Martin
patent: 4497713 (1985-02-01), Geiger
patent: 4649025 (1987-03-01), Hwa et al.
patent: 4663053 (1987-05-01), Geiger
patent: 4692317 (1987-09-01), Greaves
patent: 5017029 (1991-05-01), Andou et al.
patent: 5200031 (1993-04-01), Latchford et al.
patent: 5221424 (1993-06-01), Rhoades
patent: 5453401 (1995-09-01), Grivna et al.
patent: 5482566 (1996-01-01), Lee
patent: 5496491 (1996-03-01), Ward et al.
patent: 5533635 (1996-07-01), Man
patent: 5607718 (1997-03-01), Sasaki et al.
patent: 5637185 (1997-06-01), Murarka et al.
patent: 5650356 (1997-07-01), Grivna et al.
patent: 5664989 (1997-09-01), Nakata et al.
patent: 5735963 (1998-04-01), Obeng
LSI Logic Corporation
Umez-Eronini Lynette T.
Utech Benjamin L.
LandOfFree
Use of corrosion inhibiting compounds in post-etch cleaning proc does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Use of corrosion inhibiting compounds in post-etch cleaning proc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of corrosion inhibiting compounds in post-etch cleaning proc will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-95823