Use of corrosion inhibiting compounds in post-etch cleaning proc

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

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216 2, 252 791, H01L 2100, H01L 21306

Patent

active

061177954

ABSTRACT:
A corrosion inhibiting cleaning process for removing etch-residue from an integrated circuit substrate is described. The corrosion inhibiting cleaning process includes: (1) obtaining an integrated circuit substrate that has undergone etching; and (2) cleaning the integrated circuit substrate using a post-etch cleaning solution including a corrosion inhibiting agent in a sufficient concentration to effectively inhibit corrosion of the integrated circuit substrate.

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