Use of cobalt tungsten phosphide as a barrier material for coppe

Details Use of cobalt tungsten phosphide as a barrier material for coppe Use of cobalt tungsten phosphide as a barrier material for coppe

1996-11-20

1997-12-09

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427437, 4274431, 437192, 437195, 437230, B05D 512, B05D 118

Patent

active

056958102

ABSTRACT:
A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.

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