Use of an on-die temperature sensing scheme for thermal...

Details Use of an on-die temperature sensing scheme for thermal... Use of an on-die temperature sensing scheme for thermal...

2005-03-29

2005-03-29

Salata, Jonathan (Department: 2837)

Electricity: electrical systems and devices

Safety and protection of systems and devices

Circuit interruption by thermal sensing

Reexamination Certificate

active

06873509

ABSTRACT:
A method of protecting an integrated circuit that includes sensing a temperature of an integrated circuit, comparing the sensed temperature with a threshold temperature and controlling operation of the integrated circuit based on the comparing.

REFERENCES:
patent: 5272035 (1993-12-01), Sekiya
patent: 5422832 (1995-06-01), Moyal
patent: 5550702 (1996-08-01), Schmidt et al.
patent: 5805403 (1998-09-01), Chemla
patent: 5898557 (1999-04-01), Baba et al.
patent: 5943206 (1999-08-01), Crayford
patent: 6051933 (2000-04-01), Aiello et al.
patent: 6259652 (2001-07-01), Heyne et al.
patent: 6272035 (2001-08-01), Dietrich et al.
patent: 6275445 (2001-08-01), Dietrich et al.
patent: 6285176 (2001-09-01), Marx et al.
patent: 6285228 (2001-09-01), Heyne et al.
patent: 6351167 (2002-02-01), Hein et al.
patent: 6351360 (2002-02-01), Kotowski et al.
patent: 6366527 (2002-04-01), Hein et al.
patent: 6373671 (2002-04-01), Watanabe et al.
patent: 6388944 (2002-05-01), Schrögmeier et al.
patent: 6404610 (2002-06-01), Chang
patent: 6480024 (2002-11-01), Dietrich et al.
patent: 20010033523 (2001-10-01), Hein et al.
patent: 20010038566 (2001-11-01), Schrogmeier et al.
patent: 20020075707 (2002-06-01), Dietrich et al.
patent: 20020079925 (2002-06-01), Dietrich et al.
patent: 20020089319 (2002-07-01), Heyne et al.
patent: 20020093855 (2002-07-01), Heyne et al.
patent: 20020097541 (2002-07-01), Wei et al.
patent: 20020133750 (2002-09-01), Dietrich et al.
patent: 20020141279 (2002-10-01), Dietrich et al.
patent: 20030001636 (2003-01-01), Partsch et al.
patent: 20030012322 (2003-01-01), Partsch et al.
Pending Patent Application Assigned to Infineon Technologies North America Corp.: U.S. Appl. No. 10/144,597, filed May 13, 2002, Inventors: Alexander et al.
Pending Patent Application Assigned to Infineon Technologies North America Corp.: U.S. Appl. No. 10/256,539, filed Sep. 27, 2002, Inventors: Partsch et al.
Pending Patent Application Assigned to Infineon Technologies North America Corp.: U.S. Appl. No. 10/260,919, filed Sep. 30, 2002, Inventors: Partsch et al.
U.S. Appl. No. 10/144,579, filed May 13, 2002, Edmonds et al.
Pending U.S. Appl. No. 10/144,579, filed May 13, 2002, inventors Edmonds et al.

Affiliated with

Also associated with

Rating

Use of an on-die temperature sensing scheme for thermal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of an on-die temperature sensing scheme for thermal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of an on-die temperature sensing scheme for thermal... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3431971