Semiconductor device manufacturing: process – Making passive device
Reexamination Certificate
2008-09-16
2008-09-16
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Making passive device
C257SE21022
Reexamination Certificate
active
11545251
ABSTRACT:
A method for forming and packaging an integrated circuit having a plurality of circuit components on a semi conductive substrate die. The plurality of circuit components include at least one active component that operates on an information signal, a tuning node coupled to the at least one active component, an Electro Static Discharge (ESD) protection inductor, and a chip pad. The chip pad couples to the tuning node. The ESD protection inductor communicatively couples between the tuning node and a rail formed on the semi conductive substrate die. The ESD protection inductor provides ESD protection prior to packaging of the semi conductive substrate die or in some cases prior to the installation of the packaged die on a PC board or the equivalent. The bond wire couples between the chip pad and a package pad and serves as a tuning inductor for the circuit.
REFERENCES:
patent: 6977420 (2005-12-01), Pasqualini
patent: 7002220 (2006-02-01), Jin et al.
patent: 7009308 (2006-03-01), Jin et al.
Broadcom Corporation
Garlick Bruce E.
Garlick & Harrison & Markison
Geyer Scott B.
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