Use of a U-groove as an alternative to using a V-groove for...

Details Use of a U-groove as an alternative to using a V-groove for... Use of a U-groove as an alternative to using a V-groove for...

2005-10-18

2005-10-18

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S460000, C438S700000, C438S710000, C216S017000

Reexamination Certificate

active

06955989

ABSTRACT:
The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.

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patent: 6363201 (2002-03-01), Sherrer et al.
patent: 6515309 (2003-02-01), Tohyama et al.

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