Use of a contamination shield during the manufacture of semicond

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357 84, H01L 2304

Patent

active

051969190

ABSTRACT:
A protective shield is provided on the UV transparent window of a ceramic lid for a EPROM integrated circuit package so as to prevent accumulation of foreign particulate matter thereon during the manufacture of the package.

REFERENCES:
patent: 4326214 (1982-04-01), Trueblood
patent: 4352119 (1982-09-01), Bardens et al.
patent: 4630095 (1986-12-01), Otsuka et al.
patent: 4663833 (1987-05-01), Tanaka et al.
patent: 5033615 (1991-07-01), Shima et al.
patent: 5043004 (1991-08-01), Miyauchi

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