Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...
Reexamination Certificate
2001-09-05
2004-04-06
Sergent, Rabon (Department: 1711)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Compositions to be polymerized by wave energy wherein said...
C174S256000, C428S209000, C428S423100, C428S901000, C430S004000, C430S005000, C430S018000, C522S090000, C522S093000, C522S095000, C522S096000, C522S174000, C525S123000, C525S127000, C525S440030, C525S453000, C525S454000, C525S455000, C525S528000, C525S529000, C525S530000, C525S531000, C528S073000, C528S075000, C528S080000, C528S084000
Reexamination Certificate
active
06716892
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a water-soluble resin and a resin composition that are ready to be cured by active energetic ray, and a cured article thereof. The present invention is applicable for a coating agent, a printing ink, a photoresist, a adhesive and an printing material.
BACKGROUND OF ART
For promoting energy conservation or VOC prevention. active energetic ray such as ultraviolet ray has widely been applied for a plastic curing technology. As the VOC prevention recently asks the solubillzation of plastics, so a suitable water-soluble resin is especially desired to develop.
For manufacturing a printed circuit board, a liquid or film state of photosensitive resin composition has been used. For example, the composition is used as a resist to etching the copper foil of a copper laminated layer board, serving for the limitation of soldering positions and the protection of circuits on the printed circuit board. There is a film state of printed circuit board, called the FPC (the flexible printed circuit board), which is able ready to pack in a folding way inside a small machine such as a camera. The FPC also needs a resist, called a cover lay or a cover coat, to serve for the limitation of soldering positions and the protection of circuits on the printed circuit board. The cover lay is formed on the FPC by thermal pressure after the polyimide or the polyester having an adhesive layer is punched out into a designated shape. The cover coat is formed by printing and curing a thermosetting or photosetting ink.
For the resist to use for the limitation of soldering positions and the protection of circuits in FPC, a polyimide cover lay having excellent flexibility is often applied because the flexibility is the especially important property. The cover lay, however, needs a high-priced metal mold for punching out and a manual work for bonding the punched-out films, together with the adhesive agent projected out, causing a low production yield and a high production cost. The drawback makes it difficult to promote the FPC market and to cope with the recent high-density technology.
On the background art, it has been desired to provide a photosensitive resin composition, especially a photosensitive film to form a cover lay that has excellently a high precision and a high reliability in size precision and in resolving power for a photographic development (a means for picturing an image by developing succeeding to an imaging exposure). A photosensitive resin composition for forming a soldering mask was attempted to apply for the object. The composition included a photosensitive resin composition that contained an acrylate polymer and a photopolymerizable monomer as the main component (JP Laid-Open No. 56018/1978, JP Laid-Open No.1018/1979); a good heat-resistant photosensitive resin composition that contained a photosensitive epoxy resin having chalcone groups on the main chain and an epoxy resin-curing agent as the principal component (JP Laid-Open No.82073/1979, JP Laid-Open No.62636/1983); a composition that contained a novolac type of epoxy acrylate having epoxy groups and a photopolymerization initiator as the principal component (JP Laid-Open No.272/1986); and a photosensitive resin composition for forming a soldering mask that was ready to develop in an excellently safe and economical alkaline solution, containing a polymer having calboxylate groups, a monomer, a photopolymerization initiator and a thermosetting resin as the principal component (JP Laid-Open No.73148/1973, JP Laid-Open No.178237/1982, JP Laid-Open No.42040/1983, JP Laid-Open No.151152/1984). Any composition of them, however, had insufficient flexibility.
The present invention is intended to solve the above problem, that is, to provide a resin and a resin composition that is water-soluble and is ready to cure by active energetic ray. The resin and the resin composition thereof of the present invention can be diluted or dispersed with water to use, can be easily washed with water from a painting or irradiating set, or can be applied to a photoresist for developing in water or an aqueous alkaline solution.
The present invention also relates to a resin composition, a photosensitive film thereof, and a cured product thereof that are useful for a printed circuit board, more particularly to a resin composition and a photosensitive film thereof that are useful for the soldering resist for a flexible printed circuit board, the plating resist, and the interlayer dielectric material for a multi-layer printed circuit board, have excellent power for development, and can provide a cured product coated with an excellently adhesive, flexible (bendable), soldering heat-resistant, chemical resistant and gold plating-resistant surface membrane; and the cured product.
The present invention, if applied for a photoresist, is intended to provide a resin composition that can cope with the present high-density technology of a printed circuit, is excellent in photosensitivity to active energetic ray and is good to deal with, enabling to form a minute image through light exposure and development done in an organic solvent, water, or an aqueous dilute alkaline solution; a photosensitive film thereof; and a cured product thereof. The resin composition also can form the cured membrane by thermosetting in the post-curing process which is excellent in flexibility, soldering heat-resistance, heat deterioration-resistance, nonelectrolytic gold plating-resistance, acid resistance, and water resistance. Therefore, the composition may be suitable for the resist ink for developing in an organic solvent, water, or an aqueous alkaline solution, especially for a flexible printed circuit board.
DISCLOSURE OF THE INVENTION
The present invention relates to the following items:
(1) An urethane oligomer (A) obtained by reacting a polyol compound(a) with a polybasic acid anhydride(b-1) having at least two acid anhydride groups per molecule, a polyisocyanate compound(c), and a hydroxy compound having ethylenically unsaturated groups and the salt thereof.
(2) An urethane oligomer (A) according to the above (1), wherein said polybasic acid anhydride(b) having at least two acid anhydride groups per molecule has an acid value of 200-1500 mgKOH/g, and the salt thereof.
(3) An urethane oligomer (A) according to the above (1) or (2), wherein said urethane oligomer (A) has a weight-average molecular weight of 1,000-100,000, and the salt thereof.
(4) An urethane oligomer (A) according to any of the above (1) to (3), wherein said urethane oligomer (A) has an acid value of 1-200 mgKOH/g; and the salt thereof.
(5) A resin composition comprising an urethane oligomer(A) according to any of the above (1) to (4) and an unsaturated group-containing polycarboxylic acid resin(B) that is a product obtained by reacting an epoxy resin (e) having at least two epoxy groups per molecule with a monocarboxylic acid compound(f) having ethylenically unsaturated groups and a polybasic acid anhydride(b-2).
(6) A resin composition according to the above (5), wherein said epoxy resin (e) having at least two epoxy groups per molecule is represented by Formula (1):
(In the formula, X is —CH
2
— or —C(CH
3
)
2
—, n is an integer of 1 or more, and M is hydrogen or a group represented by Formula (G) as shown below:
provided that M is a group represented by Formula (G) if n is 1, while at least one M is a group represented by Formula (G) and the remainders being hydrogen if n is an integer more than 1).
(7) A resin composition comprising an urethane oligomer(A) according to any of the above (1) to (4) and a thermoplastic polymer(D).
(8) A resin composition according to the above (5) or (6). further comprising a diluent(C).
(9) A resin composition according to the above (7) or (8), wherein said diluent(C) is a reactive diluent(C-1).
(10) A resin composition according to any of the above (5) to (9), comprising a photopolymerization initiator(E).
(11) A resin composition comprising an urethane oligomer(A) according to any of the above (1) to (4), a thermoplastic polymer(D) and a
Kiyoyanagi Noriko
Koyanagi Hiroo
Matsuo Yuichiro
Mori Satoshi
Yokoshima Minoru
Nields & Lemack
Nippon Kayaku Kabushiki Kaisha
Sergent Rabon
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