Upward soldering method

Details Upward soldering method Upward soldering method

1993-11-09

1994-12-20

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2282341, 228442, H05K 334

Patent

active

053739850

ABSTRACT:
A printed wiring board having an electronic component mounted thereon is disposed with a land of pattern directed downward, and the land and a lead terminal of the electronic component are irradiated with a light beam emitted upwardly and supplied with a solder forwarded upwardly.

REFERENCES:
patent: 4501770 (1985-02-01), Bajka et al.
patent: 4842352 (1989-06-01), Sasaki et al.
patent: 5289966 (1994-03-01), Izumi et al.

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