Upright-pin-joined resin substrate, method of producing the...

Details Upright-pin-joined resin substrate, method of producing the... Upright-pin-joined resin substrate, method of producing the...

2005-11-01

2005-11-01

Zarneke, David A. (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S843000

Reexamination Certificate

active

06960729

ABSTRACT:
An upright-pin-joined resin substrate11includes a resin substrate13formed from a resin or a similar material and having a main plane13A and a pin pad17AP exposed on the main plane; and a number of pins1joined to the pin pads17AP by means of a solder HD. The pins1are obtained by shaping a wire material MT which is formed of 194 Alloy and has been heat-treated in advance at 450° C. to 900° C. The pin1includes a shaft portion1A and an enlarged-diameter portion1B having a round surface projecting in a direction opposite the shaft portion1A. The enlarged-diameter portion1B and another portion are joined to the pin pad17AP through soldering. Also disclosed is a method of producing the upright-pin-joined resin substrate; a pin to be employed in the upright-pin-joined resin substrate; and a method of producing the pin.

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Japanese Office Action for Japanese Patent Application No. 2001-228135 dated Apr. 13, 2004.

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