Upgradeable PCB with adaptable RFI suppression structures

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

361780, 257728, 333 12, 333247, 439109, H05K 118

Patent

active

060580224

ABSTRACT:
Disclosed is a printed circuit board that includes selectable structures for attenuating EMI/RFI of replaceable components. In one preferred embodiment, the printed circuit board has a power plane that is subdivided into a plurality of power islands, a ground plane, a plurality of bypass capacitors, and a connector mounted on the printed circuit board for receiving electrical components. Each bypass capacitor is connected between the ground plane and an associated one of the power islands. The connector is connected to at least two selected power island, and the selected power islands are arranged such that when a first electrical component is inserted into the connector, a first one of the selected power islands is automatically connected to a power supply pin of the first electrical component to facilitate attenuation of electromagnetic interference generated by the first electrical component in a first frequency band. Likewise, when a second electrical component is inserted into the connector, a second one of the selected power islands is automatically connected to a power supply pin of the second electrical component to facilitate attenuation of electromagnetic interference generated by the second electrical component in a second frequency band that is different then the first frequency band.

REFERENCES:
patent: 5068631 (1991-11-01), Vince
patent: 5165055 (1992-11-01), Metsler
patent: 5682298 (1997-10-01), Raynham
patent: 5736796 (1998-04-01), Price et al.
patent: 5764491 (1998-06-01), Tran
patent: 5777854 (1998-07-01), Welch et al.
patent: 5912809 (1999-06-01), Steigerwald et al.
patent: 5923540 (1999-07-01), Asada et al.

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