Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-10-11
2005-10-11
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S679000, C257S738000, C257S778000
Reexamination Certificate
active
06953998
ABSTRACT:
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such that the source and gate regions of the die, assuming a MOSFET-type device, are coupled to the substrate. Solder balls are provided adjacent to the die such that when the semiconductor device is coupled to a printed circuit board, the exposed surface of the die serves as a drain connection while the solder balls serve as the source and gate connections.
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“Flex interconnect of Multi-Chi Modules”; IBM Technical Disclosure Bulletin No. NN9312463; Dec. 1993; pp. 463-464; vol. 36, No. 12.
Fairchild Semiconductor
Nelms David
Nguyen Dao H.
Townsend and Townsend / and Crew LLP
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