Universal wafer scale assembly

Details Universal wafer scale assembly Universal wafer scale assembly

1986-05-05

1988-01-05

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

361406, 361416, H05K 118

Patent

active

047179880

ABSTRACT:
A universal wafer scale assembly substrate includes an orthogonal multilayer matrix of conductive paths that, inter alia, define a plurality of chip sites. The paths defining the chip sites are provided with termination pads at the ends thereof proximate the site.

REFERENCES:
patent: 3353263 (1967-11-01), Helms
patent: 3474297 (1969-10-01), Bylander
patent: 3525617 (1970-08-01), Bingham
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 3818279 (1974-06-01), Seeger et al.
patent: 4458297 (1984-07-01), Stopper
patent: 4467400 (1984-08-01), Stopper
patent: 4613924 (1986-09-01), Brault
patent: 4617471 (1986-10-01), Suzuki et al.

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