Universal wafer carrier for wafer level die burn-in

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S765010

Reexamination Certificate

active

10005402

ABSTRACT:
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

REFERENCES:
patent: 3731191 (1973-05-01), Bullard et al.
patent: 3849872 (1974-11-01), Hubacher
patent: 4169642 (1979-10-01), Mouissie
patent: 4281449 (1981-08-01), Ports et al.
patent: 4340860 (1982-07-01), Teeple, Jr.
patent: 4390220 (1983-06-01), Benasutti
patent: 4467400 (1984-08-01), Stopper
patent: 4506938 (1985-03-01), Madden
patent: 4554505 (1985-11-01), Zachry
patent: 4560216 (1985-12-01), Egawa
patent: 4585991 (1986-04-01), Reid et al.
patent: 4597617 (1986-07-01), Enochs
patent: 4729166 (1988-03-01), Lee et al.
patent: 4739257 (1988-04-01), Jenson et al.
patent: 4766371 (1988-08-01), Moriya
patent: 4783719 (1988-11-01), Jamison
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4918374 (1990-04-01), Stewart et al.
patent: 4924353 (1990-05-01), Patraw
patent: 4924589 (1990-05-01), Leedy
patent: 4956602 (1990-09-01), Parrish
patent: 4961053 (1990-10-01), Krug
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 4994735 (1991-02-01), Leedy
patent: 4996476 (1991-02-01), Balyasny et al.
patent: 5001422 (1991-03-01), Dahlberg et al.
patent: 5012187 (1991-04-01), Littlebury
patent: 5014161 (1991-05-01), Lee et al.
patent: 5020219 (1991-06-01), Leedy
patent: 5034685 (1991-07-01), Leedy
patent: 5034688 (1991-07-01), Moulene et al.
patent: 5053700 (1991-10-01), Parrish
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5089772 (1992-02-01), Hatada et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5123850 (1992-06-01), Elder et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5294776 (1994-03-01), Furuyama
patent: 5302891 (1994-04-01), Wood et al.
patent: 5315241 (1994-05-01), Ewers
patent: 5389556 (1995-02-01), Rostoker et al.
patent: 5399505 (1995-03-01), Dasse et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5532614 (1996-07-01), Chiu
patent: 5539324 (1996-07-01), Wood et al.
patent: 62-293629 (1987-12-01), None
“Known Good Die: Micron Technology That Works for You,” 2 pages, month unavailable, 1992.
Cloud et al., “Known-Good Die: A Key Cost-Effective MCMs,” Electronic Packaging and Production, 2 pages, Sep. 1992.
Military Stram Die, Micron Military Products Data Book, pp. 6-1 through 6-14, month unavailable, 1992.
Mills et al., “Decal Contactor with Decoder”, Research Disclosure, Jun. 1991, No. 326, 1 page.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Universal wafer carrier for wafer level die burn-in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Universal wafer carrier for wafer level die burn-in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Universal wafer carrier for wafer level die burn-in will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3904262

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.