Universal wafer carrier for wafer level die burn-in

Details Universal wafer carrier for wafer level die burn-in Universal wafer carrier for wafer level die burn-in

1996-05-24

1998-03-10

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, 324765, G01R 104

Patent

active

057265801

ABSTRACT:
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical test, it is possible to establish interconnection between the single die or separate and package the dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

REFERENCES:
patent: 4766371 (1988-08-01), Moriya
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4918374 (1990-04-01), Stewart et al.
patent: 4924589 (1990-05-01), Leedy
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 4994735 (1991-02-01), Leedy
patent: 5020219 (1991-06-01), Leedy
patent: 5034685 (1991-07-01), Leedy
patent: 5103557 (1992-04-01), Leedy

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