Universal tester to handler docking plate

Details Universal tester to handler docking plate Universal tester to handler docking plate

2003-04-29

2004-12-28

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

C324S765010

Reexamination Certificate

active

06836110

ABSTRACT:

TECHNICAL FIELD
The present invention relates generally to an apparatus and method for integrated circuit (“IC”) electrical testing, and more specifically to an apparatus and method for docking testers to handlers during an IC electrical testing process.
BACKGROUND
Semiconductor wafer fabrication involves complex manufacturing processes to produce integrated circuits on the surface of silicon wafers, and ultimately chips and other semiconductor devices. To ensure the quality of the integrated circuits produced on these wafers and chips, various testing methods have been devised to find defects, abnormalities and other items on the wafer, chip or other semiconductor device. Several such methods involve the placement of testing circuitry at various locations on the unit to be tested and the use of test signals to determine the functionality of the circuitry. Before individual devices or chips are approved and passed on, for example, they are subjected to final testing, one by one, by a suitable automatic apparatus. This test typically comprises various programmed electrical measurements that are intended to ascertain whether each device or chip conforms to certain desired functional requirements.
The generic use of device “testers” and “handlers” is well known in the semiconductor industry as tools for the electrical testing of IC components during the manufacture of semiconductor wafers, devices and chips. An IC device tester is typically an expensive piece of computing equipment that transmits test signals via tester probes to an IC device and also processes signals received from the IC device. An IC device handler is typically an expensive robot adapted to move IC devices from one location to a test location where the tester probes are located, and then back to the original location or, alternatively, some other location. Apparatuses and methods for utilizing such handlers and testers are well known, and instances of such apparatuses and methods can be found, for example, in U.S. Pat. Nos. 5,489,852; 5,945,837; and 6,118,286, for example, all of which are incorporated herein by reference in their entirety.
Device testers and device handlers are typically purchased by end IC device manufacturers from different companies. The choice of a particular device tester depends upon a number of factors, such as, for example, the number of pins associated with the IC manufacturer's IC devices. That is, the device tester must have a number of tester probes that is equal to or greater than the number of pins utilized by the most complex IC device to be tested by that tester. For example, depending upon the devices to be tested, it may be desirable to have a tester capable of testing a maximum of 50 leads, 100 leads, or even 200 leads, among others. In addition, there are various test capabilities that may or may not be present on a given tester. These include the ability to conduct digital IC tests, analog IC tests, mixed signal IC tests and high frequency IC tests, among others. Due to these differing needs among IC device manufacturers, most IC device tester manufacturers thus make a plurality of different tester types or models.
Device handlers are selected based on a number of factors as well, such as, for example, the required throughput (i.e., the rate at which IC devices are to be tested) and the specific function or functions to be performed. Specific functions include the ability to process IC devices with, for example, a TSSOP package having 14 to 28 leads, a TSSOP package having 32 to 56 leads, a SOIC package having 14 to 44 leads, a QFP package having 200 leads, and a MSOP package having 8 leads, among others. Although many handlers may be configured to be compatible with a variety of package specifications, typically only one configuration is possible at a time, with significant effort and down time being required to reconfigure the handler to a different configuration. Additionally, many IC devices require more than one type of test during the testing processing, which in turn requires more than one type of tester and/or handler. For at least the foregoing reasons, a plurality of different types of handlers are typically used by many IC device manufacturers, with most IC device handler manufacturers thus typically making a plurality of different handler types or models.
Testers are made by manufacturers such as, for example, Teradyne, Inc. of Boston Mass. and Eagle Test Systems of Mundelein, Ill., among others. In addition to there being many different manufacturers of IC device testers, each manufacturer will typically make several different kinds or models of testers. Such makes and models include, for example, the Teradyne J750, Teradyne Catalyst, Teradyne A567, Teradyne A575, Teradyne A530, Teradyne A535, Eagle E500, Eagle E364, and Eagle E200, among others. Handlers are made by manufacturers such as, for example, Multitest GmbH of Rosenheim, Germany; Yokogawa Electric Corporation of Tokyo, Japan; Delta Design of San Diego, Calif.; and Shinano Electronics Company Ltd. (Synax) of Matsumoto, Japan, among others. As in the case of testers, each handler manufacturer will typically make several different kinds or models of handlers. Such makes and models include, for example, the Multitest MT9918, Multitest MT9308, Yogokawa 9730, Delta 1688, Delta Turbo, and Synax SX1701, among others. Although the foregoing have been provided as listed examples, it is understood that many other manufacturers, makes and models of testers and handlers also exist, and that such entities and devices may increase or change in the future.
For typical IC testing to take place, a particular handler needs to be coupled or docked with a particular tester, such that a specific test site on the handler mates with a specific location on the tester. Thus, in addition to a device tester and a device handler, most conventional IC device testing systems typically include some form of interface structure as well. This interface structure may be connected to the tester probes, and typically includes a test area (i.e., socket arrangement) for receiving IC devices from the device handler. In addition, most conventional interface structures comprise a customized docking plate that is specially adapted for a particular make and model of IC device tester and a particular make and model of IC device handler. Customization is required due to the differing mounting requirements for each different tester and likewise for each different handler, as there exists no industry-wide standardization in this regard. Such docking plates can be made by the tester manufacturer or handler manufacturer, but are often custom made by the end IC device manufacturer to interface between a particular make and model of IC device tester and a particular make and model of IC device handler.
Turning now to
FIG. 1
, an exemplary handler used for the electrical testing of an integrated circuit during a commercial chip manufacturing process is illustrated in perspective view. Handler
10
(which is a Multitest MT9308, although the particular make and model is not important for these generic illustrative purposes) comprises an input loader
11
, a test site
12
, and output tubes
13
. In general, an IC device to be tested (not shown) is loaded into a tube (not shown), which is then placed at the input loader
11
of the handler
10
. The handler then transfers this IC device in automated fashion to the test site
12
, which comprises a window within the handler, and arranges the IC device into a position on a test socket to be tested by an IC device tester (not shown). The handler then issues a start signal to the tester, whereupon the tester tests the IC device, and the tester then sends an “accept” or “reject” signal to the handler. The handler then sorts the IC device according to this signal from the tester, and the IC device is sent to the appropriate “accept” or “reject” tube among output tubes
13
.
Referring to
FIGS. 2 and 3
, the exemplary handler of FIG.
1
and an accompanying tester used for the electrical testing of an int

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