Universal test circuit for integrated circuit packages

Details Universal test circuit for integrated circuit packages Universal test circuit for integrated circuit packages

1985-07-02

1987-08-04

Karlsen, Ernest F.

Electricity: measuring and testing

Plural, automatically sequential tests

324158R, G01R 3128

Patent

active

046848843

ABSTRACT:
An integrated circuit which facilitates measurement of various integrated circuit packaging parameters, including atmospheric moisture content, impurity content, water vapor transmission rate of encapsulant, corrosion of metallization, temperature, thermal impedance, and strain sensing. This circuit can be interconnected via both wire bonding and mass bonding, and it functions as a test vehicle for the tape automated bonding process. This circuit includes a plurality of subcircuits arranged in a square array such that the test capabilities of both the complete circuit and each individual subcircuit is identical.

REFERENCES:
patent: 4140967 (1979-02-01), Balasubramanian et al.

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