Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1997-06-11
1999-06-08
Kincaid, Kristine
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
438614, H05K 116
Patent
active
059106441
ABSTRACT:
A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale). The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.
REFERENCES:
patent: 4068022 (1978-01-01), Glick
patent: 4109297 (1978-08-01), Lesh et al.
patent: 5169680 (1992-12-01), Ting et al.
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5249728 (1993-10-01), Lam
patent: 5272596 (1993-12-01), Honore et al.
patent: 5400221 (1995-03-01), Kawaguchi
patent: 5420073 (1995-05-01), DiGiacomo et al.
patent: 5485352 (1996-01-01), Shibuya et al.
patent: 5587336 (1996-12-01), Wang et al.
Goodman Dale E.
Hoffmeyer Mark K.
Krabbenhoft Roger S.
Bussan Matthew J.
International Business Machines - Corporation
Kincaid Kristine
Lahtinen Robert W.
Silverio William
LandOfFree
Universal surface finish for DCA, SMT and pad on pad interconnec does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Universal surface finish for DCA, SMT and pad on pad interconnec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Universal surface finish for DCA, SMT and pad on pad interconnec will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1684407