Universal surface finish for DCA, SMT and pad on pad interconnec

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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438614, H05K 116

Patent

active

059106441

ABSTRACT:
A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale). The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

REFERENCES:
patent: 4068022 (1978-01-01), Glick
patent: 4109297 (1978-08-01), Lesh et al.
patent: 5169680 (1992-12-01), Ting et al.
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5249728 (1993-10-01), Lam
patent: 5272596 (1993-12-01), Honore et al.
patent: 5400221 (1995-03-01), Kawaguchi
patent: 5420073 (1995-05-01), DiGiacomo et al.
patent: 5485352 (1996-01-01), Shibuya et al.
patent: 5587336 (1996-12-01), Wang et al.

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