Universal solder pad

Details Universal solder pad Universal solder pad

2011-03-29

2011-03-29

Levi, Dameon E (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S763000, C361S766000, C361S768000

Reexamination Certificate

active

07916495

ABSTRACT:
A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second pad units are electrically connected to the first and second conductive parts of the SMD component, respectively. Each of the first and second pad units includes a main portion and a first extension portion. The first extension portion is extended from a first sidewall of the main portion and includes a first border, a second border and a third border. The second border and the third border of the first extension portion are parallel with each other for facilitating alignment of the first and second conductive parts of the SMD component with respect to the first pad unit and the second pad unit.

REFERENCES:
patent: 5303122 (1994-04-01), Adams et al.
patent: 5683788 (1997-11-01), Dugan et al.
patent: 6115262 (2000-09-01), Brunner et al.
patent: 7084353 (2006-08-01), Downes

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