Universal probe card for use in a semiconductor chip die sorter

Details Universal probe card for use in a semiconductor chip die sorter Universal probe card for use in a semiconductor chip die sorter

1990-12-12

1992-06-23

Nguyen, Vinh

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158F, 439482, G01R 3102

Patent

active

051246465

ABSTRACT:
In a probe card, a plurality of holes are provided in a performance board and a probe needle is inserted through the hole and movable via the performance board in an up/down motion without being secured to the performnce board. A spring is held in place around the probe needle. A securing board is located relative to the performance board and a plurality of pistons each has an end which is projected via the securing board and are provided on the securing board to allow the corresponding probe needle to push. Upon the operation of the air cylinder in a position corresponding to the pad of the chip to be tested, the corresponding probe needle is selectively pushed, by the projecting end of the piston, into contact with the pad of any detected chip to start the measurement of the chip. When the air cylinder is not operated, the corresponding probe needle is pushed up, by the spring, away from the chip. Probe needles can be properly selected by one probe card and handle the corresponding pads of various types of semiconductor elements. Since the probe needles are not secured to the associated board, the present probe card can readily cope with the situation which would otherwise require a whole or partial replacement of the probe needles with new ones in accordance with various types of semiconductor devices.

REFERENCES:
patent: 2954521 (1960-09-01), McKee
patent: 4138643 (1979-02-01), Beck et al.
patent: 4926119 (1990-05-01), Prokopp

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