Universal pad pitch layout

Details Universal pad pitch layout Universal pad pitch layout

1992-03-16

1992-10-13

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 51, 437211, 437220, 357 70, H01L 2160

Patent

active

051550652

ABSTRACT:
A method for configuring a plurality of pads (305) on a semiconductor die (300) to accommodate more than one pad pitch. Pad sizes and pad to pad spacings are adjusted to achieve the pad configuration. A pattern may form in the pad configuration. The pattern is repeated to meet the number of pads needed in an application. Even though the pad pitch changes to accommodate various sizes of I/O's and package lead pitches, a fixed contact pitch probe card can be used for various pad pitches and patterns.

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patent: 5015600 (1991-05-01), Livermore et al.
patent: 5023202 (1991-06-01), Long et al.
patent: 5034349 (1991-07-01), Landis
patent: 5039628 (1991-08-01), Carey

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