Universal packaging system for electrical components and the lik

Package making – Methods – Applying a partial cover

Patent

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Details

53452, 53459, 53475, 53558, 53585, B65B 1100, B65B 510

Patent

active

049148907

ABSTRACT:
A universal packaging system for objects such as electrical components, connectors, semiconductors, chips, etc. includes an elongated, hollow, tubular package formed of resiliently deformable material for containing a plurality of said objects, each object having an identical or substantially similar silhouette or profile and orientated with a predetermined axis of its profile, aligned along a common longitudinal axis or line within the tube. A package is formed providing protection for the connectors during storage, handling, and shipment, and the tube also serves as a feed magazine for dispensing the objects at an assembly station or other work station as needed. The present invention also features an apparatus and method for loading packages of connectors and for unloading or feeding connectors from the packages at a point of end usage.

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