Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including high voltage or high power devices isolated from...
Reexamination Certificate
2005-03-15
2005-03-15
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Including high voltage or high power devices isolated from...
C257S513000, C257S520000, C257S622000
Reexamination Certificate
active
06867471
ABSTRACT:
An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.
REFERENCES:
patent: 5306670 (1994-04-01), Mowatt et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6239482 (2001-05-01), Fillion et al.
patent: 6717276 (2004-04-01), Walter et al.
patent: 6720647 (2004-04-01), Fukuizumi
patent: 20020048828 (2002-04-01), Sakamoto et al.
patent: 20020110956 (2002-08-01), Kumamoto et al.
patent: 20030102538 (2003-06-01), Paulus
patent: 20030116840 (2003-06-01), Hacke et al.
patent: 100 29 269 (2002-01-01), None
patent: 100 31 204 (2002-01-01), None
patent: 101 37 184 (2003-02-01), None
patent: 0 186 818 (1986-07-01), None
patent: 0 439 134 (1991-07-01), None
patent: 09172043 (1997-06-01), None
patent: 10242372 (1998-09-01), None
patent: 11246672 (1999-09-01), None
patent: 2001262254 (2001-09-01), None
patent: 9217901 (1992-10-01), None
patent: 03015165 (2003-02-01), None
Goller Bernd
Hagen Robert-Christian
Ofner Gerald
Stuempfl Christian
Wein Stefan
Fenty Jesse A.
Greenberg Laurence A.
Infineon - Technologies AG
Jackson Jerome
Mayback Gregory L.
LandOfFree
Universal package for an electronic component with a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Universal package for an electronic component with a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Universal package for an electronic component with a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3408567