Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-01-04
2003-08-12
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C206S708000, C361S802000
Reexamination Certificate
active
06606248
ABSTRACT:
FIELD OF THE INVENTION
This invention relates in general to handling semiconductor substrate trays and, more particularly, to a modularly stackable, adjustable tray for storing, transporting, and handling a semiconductor integrated circuit device.
BACKGROUND OF THE INVENTION
Various techniques have been developed for the storing, transporting, and handling of semiconductor integrated circuit devices. Many semiconductor devices, such as printed circuit boards, are expensive and delicate. Accordingly, they must be carefully handled after processing for storage and shipment. Such boards can be fragile under loads applied to the surface of the board that typically carries components. Since such semiconductor devices are rather resistant to end loads or compression forces that act edgewise upon the board, the concept of slotted devices for holding and transporting semiconductor devices has been conventionally used.
For example, U.S. Pat. No. 3,664,510 (Kerschbaum) shows a card cage for printed circuit cards in which flexible plastic members are mounted in a metal frame to hold the printed cards in place in a vertical orientation. Further, U.S. Pat. No. 3,458,767 (Hedger) shows a rack that has opposed rows of parallel guides into which circuit boards can be slid into place. These holders are typical of the type of devices used to hold circuit boards. However, the holders are not adjustable to accommodate varying substrate sizes.
One circuit board holder having adjustable compartments is described in U.S. Pat. No. 4,158,876 (Pedro). However, Pedro requires that the circuit boards be secured by sliding opposing edges of the board through opposing elongated recesses. Such extensive contact can cause damage to components on the board. Also, since the board merely rests on a lower lip of the compartment when inserted, only the pull of gravity on the board can keep the board secure. Furthermore, the holder in Pedro is not stackable.
Given these limitations of the prior art, there is a clear need for an improved tray for storing, transporting, and handling semiconductor devices.
SUMMARY OF THE INVENTION
The present invention provides a universal memory module/printed circuit board storage, transport, and automation handling tray. In one aspect in particular, the invention comprises an adjustable tray for semiconductor devices.
In one embodiment, the semiconductor device trays comprise opposing front and back frame segments, opposing side frame segments containing a longitudinal channel, a fixed locator segment secured to the tray, and an adjustable locator segment temporarily secured to the longitudinal channel. In these embodiments, both the fixed locator segment and the adjustable locator segment comprise distal ends and slots for receiving the semiconductor devices. The distal ends have a guide element that is received by the longitudinal channels.
In one embodiment, a middle portion of the slots in the locator segments has a slot width that ensures the semiconductor device is friction fit when placed into the slots. As the semiconductor devices are received by the tray, contact between the devices and the slots is restricted to keep-out areas. As such, components on the semiconductor device do not contact the tray.
In another embodiment, the adjustable locator segment is moved with respect to the fixed locator segment such that the distance between the two segments corresponds to the width of the semiconductor device. In a further embodiment, the tray pitch present on the locator segments is greater than the aggregate thickness of the semiconductor device. In such embodiments, the tray pitch is the distance between adjacent slots on a locator segment, and the aggregate thickness is the thickness of the semiconductor device and any protruding components disposed on the device.
In yet another embodiment, the front, back, and opposing side frame segments can include stand-off receptacles. The stand-off receptacles are configured to receive and removably secure stand-offs so that a second adjustable semiconductor tray can be mounted on the stand off of a first tray. Mounting in this fashion provides vertical separation between the two (or more) adjustable semiconductor trays. In another embodiment as shown in
FIG. 1A
, the opposing side frame segments provide the vertical separation. In these embodiments, the side frame segments extend upwardly from a first tray and are received by a second tray mounted on the first. The side frame segments are taller than the height of the device.
In one embodiment, the fixed locator segment is secured to the front frame segment and/or the opposing side frame segments. In another embodiment, the guide element can be a salient, a tongue, a detent, a dove-tail, a gear, a roller, a pulley, a flange, and/or a ball. In such embodiments, the longitudinal channels can contain a mating guide element that is a gear, a chain, a belt, ball bearings, and/or a lubricant.
In a further embodiment, the tray comprises a locking mechanism for temporarily securing the adjustable locator segment. In still other embodiments, the front, back, opposing side, fixed locator, and adjustable locator segments comprise one or more static dissipating materials such as Semitron ESD 225, a trademark for a static dissipative acetal.
In another embodiment of the present invention, the trays comprise opposing front and back frame segments, opposing side frame segments containing a longitudinal channel, a fixed locator segment secured to the tray, and an adjustable locator segment temporarily secured to the longitudinal channel. In these embodiments, both the fixed locator segment and the adjustable locator segment comprise distal ends and slots for receiving semiconductor devices therein. The distal ends have a guide element that is received by the longitudinal channels. When the slots receive the semiconductor devices, the devices are temporarily secured by a friction fit, and contact between a device and a slot is restricted to the keep-out areas. The keep-out areas can comprise a portion of one or more lower peripheral regions of a semiconductor device that is devoid of electrical components.
In another embodiment, the slots of the fixed locator segment and/or the adjustable locator segment can comprise slot walls with an upper portion that is tapered, rounded, or otherwise configured to assist in guiding a semiconductor device into the slot. In further embodiments, an adjustable locator segment is moveable, with respect to the fixed locator segment, to correspond to the width of the semiconductor device. In still further embodiments, when received and secured in a tray, the semiconductor devices are transverse to the tray.
In still another embodiment, the tray comprises opposing front and back frame segments and opposing adjustable locator segments. In such embodiments, each side frame segment contains a longitudinal channel and is secured to the front frame segment and/or the back frame segment. Further, the opposing adjustable locator segments comprise distal ends and slots for receiving semiconductor devices. In these embodiments, the distal ends have a guide element that is received by, and temporarily secured within, the longitudinal channel.
In yet another embodiment, the opposing adjustable locator segments are adjustable such that the distance between the opposing locator segments corresponds to the width of a semiconductor device.
Another aspect of the present invention provides a modular tray system. In one embodiment, the system comprises semiconductor devices having electrical components disposed thereon and at least two trays for receiving the devices therein. In such embodiments, the semiconductor device trays comprise opposing front and back frame segments, opposing side frame segments containing a longitudinal channel, a fixed locator segment secured to the tray, and an adjustable locator segment temporarily secured to the longitudinal channel. In these embodiments, both the fixed locator segment and the adjustable locator segment comprise distal ends and slots for re
Gandhi Jayprakash N.
Micro)n Technology, Inc.
Phan Thanh S.
Whyte Hirschboeck Dudek SC
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